Molao oa CHIPS o na le maemo a eketsehileng: ha ho letsete kapa tlhahiso ea lichifi tse tsoetseng pele Chaena.

Likhamphani tsa semiconductor tsa US li ke ke tsa sebelisa chelete ho aha lifeme tse tsoetseng pele China kapa ho etsa li-chips bakeng sa 'maraka oa US.
Likhamphani tsa US tsa semiconductor tse amohelang $280 bilione ho likhothaletso tsa CHIPS le Science Act li tla thibeloa ho tsetela China.Litaba tsa morao-rao li tsoa ka kotloloho ho Mongoli oa Khoebo Gina Raimondo, ea ileng a tsebisa baqolotsi ba litaba ho White House maobane.
CHIPS, kapa the America's Semiconductor Manufacturing Favorable Incentives Act, kakaretso ea $52 bilione ea $280 bilione 'me ke karolo ea boiteko ba 'muso oa kopanelo ho tsosolosa tlhahiso ea li-semiconductor ea lehae United States, e saletseng morao Taiwan le Chaena.
Ka lebaka leo, lik'hamphani tsa theknoloji tse fumanang lichelete tsa federal tlas'a Molao oa CHIPS li tla thibeloa ho etsa khoebo Chaena ka lilemo tse leshome.Raimondo o hlalositse mohato ona e le "terata ea ho netefatsa hore batho ba fumanang chelete ea CHIPS ba ke ke ba sokela ts'ireletso ea naha."
"Ha ba lumelloe ho sebelisa chelete ena ho tsetela Chaena, ba ke ke ba etsa theknoloji e tsoetseng pele Chaena, 'me ba ke ke ba romela theknoloji ea morao-rao kantle ho naha."“.sephetho.
Thibelo e bolela hore lik'hamphani li ke ke tsa sebelisa chelete ho aha lifeme tse tsoetseng pele Chaena kapa ho hlahisa lichifi bakeng sa 'maraka oa US naheng e ka bochabela.Leha ho le joalo, lik'hamphani tsa theknoloji li ka eketsa bokhoni ba tsona ba ho etsa li-chip China feela haeba lihlahisoa li lebisitsoe 'marakeng oa China feela.
Raimondo o ile a araba motlalehi e mong oa litaba: “Haeba ba nka chelete ’me ba etsa leha e le efe ea lintho tsena, re tla khutlisa chelete eo.Raimondo o netefalitse hore lik'hamphani tsa Amerika li ikemiselitse ho latela lithibelo tse boletsoeng.
Lintlha le lintlha tse tobileng tsa lithibelo tsena li tla etsoa qeto ka February 2023. Leha ho le joalo, Raimondo o ile a hlakisa hore leano la kakaretso le itšetlehile ka ho sireletsa tšireletso ea naha ea United States.Kahoo, ha ho hlake hore na lik'hamphani tse seng li tsetetse China mme li phatlalalitse tlhahiso e atolositsoeng ea li-node naheng li lokela ho furalla merero ea tsona.
"Re tlil'o hira batho bao e kileng ea e-ba babuelli ba litaba tse thata lefapheng la poraefete, ke litsebi lefapheng la semiconductor, 'me re tla buisana ka tumellano e le' ngoe ka nako 'me re hlile re beha khatello ho lik'hamphani tsena hore li re kholisehe - re hloka hore ba e etse ho latela tlhahiso ea lichelete, ba re netefatse mabapi le matsete a lichelete - ba re netefatse hore chelete e hlile e hlokahala ho etsa letsete leo.
Ho tloha ha molao o sa tloaelehang oa bipartisan, Molao oa Chip, o saennoe hore e be molao ka Phato, Micron e phatlalalitse hore e tla tsetela $40 bilione tlhahisong ea US bofelong ba lilemo tse leshome.
Qualcomm le GlobalFoundries li phatlalalitse tšebelisano ea $ 4.2 bilione ho matlafatsa tlhahiso ea semiconductor setsing sa morao-rao sa New York.Pejana, Samsung (Texas le Arizona) le Intel (New Mexico) li phatlalalitse matsete a libilione tsa lidolara lifemeng tsa chip.
Ho liranta tse limilione tse likete tse 52 tse abetsoeng Molao oa Chip, liranta tse limilione tse likete tse 39 li ea ho tlhahiso e hlasimollang, $ 13.2 limilione tse likete li ea ho R&D le nts'etsopele ea basebetsi, 'me chelete e setseng ea $ 500 milione e ea mesebetsing ea phepelo ea li-semiconductor.E boetse e hlahisitse sekoloto sa lekhetho la matsete sa 25% ho litšenyehelo tse sebelisoang ho etsa li-semiconductors le lisebelisoa tse amanang le tsona.
Ho latela Semiconductor Industry Association (SIA), tlhahiso ea semiconductor ke indasteri ea $ 555.9 billion e tla bula fensetere e ncha ka 2021, ka 34.6% ($ 192.5 billion) ea lekeno leo le eang China.Leha ho le joalo, baetsi ba Machaena ba ntse ba itšetlehile ka meralo le theknoloji ea semiconductor ea US, empa tlhahiso ke taba e fapaneng.Ho etsa semiconductor ho hloka lilemo tsa liketane tsa phepelo le lisebelisoa tse theko e phahameng joalo ka lits'ebetso tse feteletseng tsa ultraviolet lithography.
Ho hlola mathata ana, mebuso ea kantle ho naha, ho kenyeletsoa mmuso oa China, e kopantse indasteri mme e tsoela pele ho fana ka likhothatso bakeng sa tlhahiso ea li-chip, e leng se bakileng ho theoha ha matla a tlhahiso ea semiconductor ea US ho tloha ho 56.7% ka 2013 ho isa ho 43.2% ka 2021.Leha ho le joalo, tlhahiso ea li-chip tsa US e etsa karolo ea 10 lekholong feela ea kakaretso ea lefatše.
Molao oa Chip le mehato ea thibelo ea matsete ea China le tsona li thusitse ho matlafatsa tlhahiso ea li-chip tsa US.Ka 2021, 56.7% ea metheo ea tlhahiso ea lik'hamphani tse ntlo-kholo ea US e tla be e le mose ho maoatle, ho latela SIA.
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Nako ea poso: May-29-2023